New polymer particles for electronics and micro-systems

Together with its customer, Conpart are actively seeking new applications for ACF, where the polymer, or alternatively "hybrid" particles produced by Conpart can be utilised. The ACF connection primarily relies on a contact created by mechanical contact f orces. The mechanical properties of the particles are therefore of crucial importance to the reliability and design of ACF. Different types of particles are used for different applications. For LCD technology, metallized polymer spheres are dominating. Fo r plasma displays and solder replacement, harder particles are often needed. Today, solid metal particles are often used for these applications. However, these particles have a very limited elastic range, and either the particles or the pads will mainly b e deformed plastically during the bonding process. This is a serious reliability problem, as there is very limited elastic deformation available to compensate for expansion caused by temperature and humidity in the bonding adhesive. These applications are very demanding and represent the cutting edge for the development of solder free interconnects. In this project Conpart seeks to develop the next generation of materials for interconnect technology aiming at an environmentally friendly replacement to so ldering and solid metal particles.