Robust inlay modules in laminated cards

DROPIN project's main goal was to develop reliable and low-cost packaging technology in flexible packages of polymeric materials with the ability to withstand harsh environments. The project has worked iteratively to develop several prototypes. The project has developed new methods for production of powered smart cards. The main challenge has been to find low-temperature and low-cost manufacturing methods. Laerdal is now considering these processes and technology for industrialization. SIMLINK has through this project developed a new "BlueSim" card. The project has addressed the problem of electronics miniaturization and challenges with embedded micro-antennas. Testing and evaluation of robustness has resulted in prototypes that have been used in a field test in cooperation with an international telecom operator. Through the DROPIN project Norbitech has established processes for the production of thin flexible substrates and will be producing the first commercial series BlueSim from SIMLINK.

Future advanced smartcards and credit cards may become multi-functional and contain fingerprint reader, accelerometers, Wi-Fi, NFC, batteries, energy harvesting circuitry, solar panels, keypads, LED, displays and various other sensors in addition to a sec ure element which is already present. The partners in the proposed project are currently developing innovative products that require the integration of several components in a smart card format. The companies are facing similar challenges; namely a need f or new assembly and interconnection technologies for low-cost, high-volume production of highly integrated smart card products. Research is required to fully understand, develop and optimise these technologies in order to deploy them in a successful manne r. The project aims to establish and verify robust hybrid microelectronics packaging and interconnection technologies that will fulfill the requirements of low-cost mass production along with durable and reliable operation in a harsh environment endured b y smart cards. Research on materials and processing is required to understand how to optimize the combined underfilling, molding and embedding processes. The study of failure mechanisms will be an important task, and only by understanding the physics behi nd a failure, it can be predicted or prevented. The project will establish prototype production facilities at Norbitech, and through a number of industrial cases from the partners the project will make prototypes for testing and failure analysis. A thorou gh assessment of reliability and failure mechanisms for the prototypes will further enhance the design rules for such products. The innovations from the project will constitute the platform on which the participating partners will base their current and f uture designs and products.