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IKTPLUSS-IKT og digital innovasjon

MEMS WAFER LEVEL PACKAGING

Awarded: NOK 79,749

Project Manager:

Project Number:

272836

Application Type:

Project Period:

2017 - 2017

Location:

In this project we will review the technical requirements for MEMS wafer level packaging (WLP) and the capabilities in Norway and if needed internationally. The main source of knowlege is currently with SINTEF Minalab.

Activity:

IKTPLUSS-IKT og digital innovasjon