Back to search

IKTPLUSS-IKT og digital innovasjon

ECSEL-prosjekt APPLAUSE; Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe - Norwegian part

Awarded: NOK 8.6 mill.

Microsystems as an important part of electronics are becoming more and more complex and require ever more sophisticated electronics design methods and often include optics and photonics. This creates an opportunity to keep the production and assembly chain here in Europe - or even begin to take it back. APPLAUSE supports this by building on the European expertise in electronic packaging and interconnection technologies to develop advanced new tools, methods and processes for high volume production of electrical and optical components. The technologies will be piloted in 5 industrial applications: 1. Light sensor for mobile and portable applications. 2. High performance, low cost, uncooled thermal IR sensor for automotive and surveillance applications. 3. High speed data communication transceivers at reduced production costs. 4. Flexible chest straps and miniaturized implants for advanced heart monitoring. 5. Cost effective optical water measurement modules. The APPLAUSE consortium has a number of leading experts from European companies in the field of electronics construction methods, which represent different value chain levels related to electronics construction methods and smart system integration. The parties have complementary expertise in idea-conception, design, packaging, testing and production of electronic components, as well as a wide range of expertise from several different end-user areas. The unique European ecosystem established within the consortium represents the competitive, leading technology available. Norwegian partners are IDEAS, Cardiaccs and USN. The project is on track as planned by December 1st 2020. 1. IDEAS has designed and received from subcontractors the first prototypes of CMOS integrated chips with bolometer array infrared sensor elements. These are called ROIC (Read Out Integrated Circuits) chips. These will now be laboratory tested for functionality. This is an important step towards prototypes of fully assembled IR cameras. 2. USN has developed process technology for disk level assembly of ROIC chips together top chips with infrared window so that the ROIC chips are encapsulated in vacuum. Currently only with sample chips (dummy) Process for etching the IR window at DRIE (Deep Reactive Ion Etching has been successfully developed. The assembly is done with a process called SLID (Solid Liquid InterDiffusion) sealing so that the ROIC chips with the bolometer sensor elements are environmentally protected with ultra-low vacuum. 3. 4. Cardiaccs and its partners have prepared requirements specification for their future product "Cardisense" and have manufactured the first prototypes for clinical testing.

-

The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufacturing and packaging value chain to Europe - or even start to bring it back. APPLAUSE supports this by building on the European expertise in advanced packaging and assembly to develop new tools, methods and processes for high volume mass manufacturing of electrical and optical components. The technologies will be piloted in 5 industrial Use Cases, related to 1. Substantially smaller 3D integrated ambient light sensor for mobile and wearable applications (AMS) 2. High performance, low cost, uncooled thermal IR sensor for automotive and surveillance applications (IDEAS) 3. High speed Datacom transceivers with reduced manufacturing costs (DustPhotonics) 4. Miniaturized cardiac implants with advanced monitoring capabilities (Cardiaccs) 6. Optical water measurement modules with cost-effective packaging of components (Vaisala) The APPLAUSE consortium is built of a number of leading experts from European electronics packaging companies representing different value chain levels related to advanced packaging and smart system integration. The parties have complementary expertise in conception, design, packaging, testing and manufacturing of electronic components, as well as a wide range of expertise from several different end use areas. The unique European ecosystem established within the consortium represents the competitive, leading edge of the technologies available. The Norwegian partners will mainly be involved in "2. High performance, low cost, uncooled thermal IR sensor for automotive and surveillance applications (IDEAS USN) and in "4. Flexible cardiac monitoring patch and miniaturized cardiac implants with advanced monitoring capabilities (Cardiaccs)". Text adapted from APPLAUSE Project summary.

Funding scheme:

IKTPLUSS-IKT og digital innovasjon