GO4TGS - Gyro Optimized for Tactical Grade Systems

Gyroscopes (gyros) are devices that help vehicles, drones, and portable / handheld electronic devices know where they are in a three-dimensional space. You will find them in almost all electronics that we use in everyday life. The underlying goal of this project is to improve the fabrication of Sensonor's gyro sensor die by developing a new, advanced etching process for silicon. The process makes the design of microstructures in silicon more accurate; down to nanometer precision. The sensor chip made in silicon and glass is used in all Sensonor's gyro- and IMU (Inertial Measurement Unit)- products which already have a solid market position. In addition to further improving the performance of the very best gyro sensor chips, a new etching process is expected to increase the production yield by a factor four. In this way, the project will improve Sensonor's competitiveness and profitability through increased opportunities to penetrate new emerging markets (e.g. autonomous vehicles) and by strengthening the opportunities for increased market share in existing markets. Sensonor and SINTEF MiNaLab have managed to set a good foundation for further manufacturing improvement. A method for evaluating the effect of process parameter variation on the resulting "tilt" has been developed and the first experimental plan has been implemented, which provides a solid start to the work of developing new and improved manufacturing processes for existing Sensonor products and for new products with exciting market opportunities. in the pursuit of a greener society.

-

The underlying idea is to develop a new, advanced etching process with nanometer level accuracy that will increase the yield in the fabrication process for Sensonor's gyroscope sensor by at least a factor four . This gyroscope sensor is used in all Sensonor's gyro and IMU (Inertial Measurement Unit) products that today holds a solid market position. These products are in regular use at global leading companies in commercial, defense and aerospace applications. The main feature for increasing production efficiency is identified to be the slightly tilted angle that otherwise vertical silicon surfaces exhibit after the plasma-based through-etch of the silicon structures. This etch defines the springs of the mass/spring gyro system. The tilt will be minimized by developing a new etch process based on state-of-the-art etch tools. Additionally, deeper-lying mechanisms that reduce yield and keep performance from reaching its utmost potential will be explored and their effects reduced. The project will improve the competitiveness of Sensonor and at the same time increase utilization of raw materials and reduce waste. It will enable Sensonor to address markets currently not within reach due to product cost. Sensonor will use the innovations of this project to expand its market share in existing markets and penetrate new, emerging markets with large forecasted growth, such as autonomous vehicles. Sensonor and SINTEF MiNaLab will work together in this effort to develop new and improved fabrication processes for existing Sensonor products and for new products that have exciting market opportunities in the quest for a greener society. The improved process steps will be integrated into Sensonor's foundry services. This will enable industry to explore their novel product ideas by exploiting world class MEMS processes, with access to key personnel, and for Norwegian companies at a convenient location. These exciting opportunities will be widely advertised during this project.