Manufacturing and application of metal coated polymer particles as BGA/CSP balls in electronic interconnect

Norwegian particle technology have been of a very high international standard for decades, not least due to ground-breaking R&D at SINTEF / NTNU. Conpart has through the supply agreement signed with a world leading manufacturer already shown that this tec hnology represents a very interesting alternative also for use in the electronics industry. In this proposed project Conpart aims at the market for solder balls used in Ball Grid Array (BGA) and Chip Scale Package (CSP). Until now, this market has been to tally dominated by solid metal balls, which is causing serious concerns regarding reliability (due to lack of compliancy) and environmental aspects (large amounts of heavy metals). The idea is to replace these balls with metal plated polymer particles, an d hence combine improved mechanical flexibility with a large reduction of metal consumption The project addresses both the manufacturing of the metal plated polymer particles as well as pad design and solder fillet to be able to reap the potential benefi ts given by the increased flexibility. The manufacturing of these balls combines elements of nano-technology (metal deposition and nano-layers of oxidation inhibitors) with highly advanced particle manufacturing technologies. The materials and structure a lso represents truly functional materials, providing electrical interconnection and mechanical stability. The project will be conducted by Conpart, in strong collaboration with SINTEF (particle manufacturing and characterisation), NTNU (mechanical modelli ng and optimalisation of solder joints and particles) and Western Norway Research Institute (environmental aspect). In addition, the project will develop a close collaboration with a large UK project on future manufacturing techniques for electronics call ed 3D-Mintegration and EC-GEPRO, an EU project aiming at environmentally friendly materials and manufacturing processes in electronics