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BIA-Brukerstyrt innovasjonsarena

Fine Pitch Interconnect of Microelectronics and Microsystems for use in Rough Environments

Tildelt: kr 6,7 mill.

Electrical interconnect and packaging of electronic components is a highly challenging and critical field. Electronics are put into numerous new applications and significantly more hostile environments. This includes increasing exposure to extreme tempera ture, mechanical loading like acceleration, shock, vibration and bending as well as exposure to humidity and chemicals. The Norwegian company Conpart is developing metallized polymer particle technology for use in electronic interconnects. Technologies based on these particles can give benefits like finer pitch, improved mechanical properties and improved reliability in rough environments. The Conpart particles are currently implemented in large volumes for display applications. Through the KMB project , SINTEF and Vestfold University College (HVE) together with Conpart and Norwegian industry partners want to develop the interconnect technology based on polymer particles further and implement it for new applications. The project consortium established will cover the chain from research and development to product implementation and production. Conpart contributes with development and production of polymer particles, while Idex, Nammo and WesternGeco all have interconnect challenges within their product range. In addition OSI Optoelectronics will contribute with knowledge on packaging processes and manufacturability. SINTEF and HVE together cover all aspects of microsystem technology from MEMS design and processing to packaging and reliability. The pro ject will be divided in three main tasks: Feasibility study, process development and reliability testing. In parallel with these tasks a PhD work will be carried out, going in depth on selected subjects within the project. In addition a minimum of three i ndustry cases will be investigated through the project. The cases selected have interest for the whole consortium group and will serve to direct the competence building towards the industry needs.

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BIA-Brukerstyrt innovasjonsarena