A new Color X-ray "Camera-on-a-Chip" technology for CT

This project is a based on a transatlantic collaboration with the support several research universities and laboratories. Interon AS, Norway, and DxRay Inc., Ca., USA, are the commercial partners, IPR holders and the commercial beneficiaries. CERN, the Eu ropean physics research laboratory, University of Oslo and University of California Santa Barbara are R&D partners, of which CERN is the primary. In this project we want to develop and demonstrate a novel modular x-ray detector-module (InterPix) for CT a pplications, accomplished through further development of the already existing platform of the combined recent years achievements of Interon, CERN and DxRay. Specifically, a product will be created through the development of i) A 2-dimentional pixel extre mely-large-size (ELS) ASIC (called CCIAD), incorporating advanced Single-Photon-Counting (SPC) functionality for Color imaging, and through the use of the novel "stiched-reticle" CMOS technology currently offered by some CMOS foundries, ii) A direct conve rsion and spectroscopic sensor material made of polycrystalline mercuric iodide (HgI2) and iii) A hybridized module of the CCIAD and the HgI2, through depositing the HgI2 onto the CCIAD surface, thus forming a tileable and "ready-to-use" CT X-ray detector module and consequently the prototype module we want to achieve in this project. The development of the CCIAD will be made by Interon with the assistance of CERN. The development of the spectroscopic HgI2 and the deposition of it onto the CCIAD will be made by DxRay. Development of necessary testing equipment, electronics assembly and testing will be performed at CERN. University of Oslo will participate in the testing and assembly activity at CERN, whereas University in Santa Barbara will participate i n the ASIC development. The project will conclude by demonstrating the features of the product including its color imaging capability and its general high performance and low production cost.