IS-BILAT-Mobilitet Norge-USA /Canada
Advanced assembly & packaging of microsystems: Research term (outbound mobility)
This project will allow for a five-month researcher exchange from Vestfold University College (HVE) to Berkeley Sensor & Actuator Center (BSAC), California, USA, in the field of microsystems packaging technology.
Microsystems technology allows miniaturiz ation of sensors, actuators and electroni...