0 antall prosjekter

IS-BILAT-Mobilitet Norge-USA /Canada

Advanced assembly & packaging of microsystems: Research term (outbound mobility)

This project will allow for a five-month researcher exchange from Vestfold University College (HVE) to Berkeley Sensor & Actuator Center (BSAC), California, USA, in the field of microsystems packaging technology. Microsystems technology allows miniaturiz ation of sensors, actuators and electroni...

Tildelt: kr 0,15 mill.

Prosjektperiode: 2007-2007

Sted: Vestfold