MEMS based Image Sensor for Applications in Thermography, Automotive and Security

IDEAS has for several years been involved in developing basic electronic equipment as ASICs and other components for embedment and integration in thermal imaging products and equipment. Infrared imaging cameras are already used across a wide spectre of industrial sectors and applications as automotive, aerospace, industry and healthcare. In 2017 more than 800 000 units of infrared cameras based on microbolometers were sold last year and about 90% in the civil sector. The applications vary - especially regarding the resolution and related costs. Low resolution detectors (<80x80 pixels) have had a steep sales growth the last years with applications in Smart Buildings, Internet of Things (IoT) while high resolution detectors (VGA or even HD) are used for surveillance, security etc. The MIMAS project aims at integrating IDEAS’ CMOS part of a microbolometer array with an existing microbolometer creating an ITAR free compact, low cost microbolometer with 17 µm pixel pitch, and also to complete the process with wafer scale vacuum packaging. The project will also be focused around pilot manufacturing, demonstrations for already waiting clients and systems validations under various working conditions. This will result in in a MEMS based miniaturized Image Sensor ready for integration into camera cores and OEM modules. Applications will be in the Thermography, Automotive and Security market. According to a new market research report on the "Thermal Imaging Market” the market is expected to be worth $ 4.0 Bn by 2023 – up from $ 2.7 Bn in 2017. The market growth has been steep and at present the CAGR for uncooled technologies are estimated to 14%. Reduction in the price of thermal imaging products, the increasing adoption of thermal imaging in perimeter security and penetration in machine vision applications are driving the growth of this market.